Document Type : Original Article
Authors
1 Department of Mechanical Engineering, Babol Noshirvani University of Technology, Babol, Iran
2 Faculty of mechanical Engineering Shariati Avenue
Abstract
The dissipation of heat generated in electronic and industrial chips is essential for the health of these components. For this purpose, one of the best choices is a microchannel heatsink, which offers a lower pressure drop compared to other channels while maintaining a high heat transfer rate. In this study, a fractal microchannel heatsink, introduced in recent years, has been numerically investigated. To enhance the performance of the microchannel, two types of fins have been added to the microchannel walls, resulting in the creation of two new geometries. In the first new geometry, fins are placed at the bottom of the microchannel, while in the second one, fins are placed on the sidewalls of the microchannel. It is worth mentioning that the volume of fins used is consistent across both geometries. Thermal and hydraulic parameters have been examined, revealing that both new geometries increase the Nusselt number, with the highest increase observed in the microchannel with fins on the sidewalls, amounting to 28%. Additionally, both geometries increase the pumping power, with the highest increase observed in the microchannel with fins at the bottom, reaching 120%. Finally, by evaluating the performance coefficient, it was determined that the microchannel with fins on the sidewalls increases the overall performance by 3 to 6% across different flow rates, whereas the microchannel with fins at the bottom reduces the system's performance by 7%. Therefore, for efficient dissipation of the generated heat, it is preferable to use a microchannel heatsink with fins on the sidewalls.
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